The 405 nm semiconductor laser subsystem delivers an output power ranging from 12 W to 50 W and is widely used in LDI/maskless lithography and other applications. The system is fully designed with a 400 µm pluggable fiber, allowing easy maintenance for users. In addition, the spot homogenization design makes it particularly well suited for LDI applications.
Cutting and drilling with high speed and without taper + many other applications: marking, engraving, texturing, ablation, welding, wirestripping, debonding, tube micromachining, turning, chamfering…
Femtosecond, picosecond and nanosecond laser machines + excimer laser solutions
Up to 7 axes (5 mechanical axes and 2 optical axes)
Simultaneous movements of mechanical and optical axes for faster and improved machining results
Autofocus
Software tailored for industrial processes and compatible with main Enterprises Resource Planning and management software
Pallets and plates control by Pick & Place robot
Industrial vision system for improved manufacturing processes (shape recognition and automatic positioning) as well as automatic quality control of manufactured pieces
