Industrial Spectral Scanner Camera – WidePIX L 2(1)X15 – MPX3

 Michael Iluz

Key Features:

  • Sensor Material: Si or CdTe
  • Sensor Thickness: 300 μm for Si; 1 mm for CdTe
  • Sensitive Area: 28 (14) x 140.8 mm
  • Number of Pixels: 512 (256) x 2560
  • Pixel Pitch: 55 μm
  • Resolution: 9 lp/mm
  • Readout Speed:170 (1×10 tiles) and 80 (2×10 tiles) frames/s
  • Readout Chip: Medipix3
  • Pixel Mode of Operation: Counting in Single Pixel Mode (SPM) or Charge Summing Mode (CSM)
  • Counter depth: 12 or 24 bits (configurable)
  • Connectivity: 2x Ethernet RJ-45
  • Weight: 3400 g
  • Dimensions: 210 mm x 190 mm x 42 mm (L x W x H)
  • Software: Pixet Pro



WidePIX 2(1)x15 – MPX3 camera consists of either 2×15 or 1×15 Medipix3 devices. Each pixel has two integrated 12-bit digital counters and two energy discrimination thresholds. Both counters can be joined to a single 24-bit counter providing enhanced dynamic range. The camera can be constructed with Si or CdTe edgeless sensor tiles. The edgeless sensor technology allows placing all tiles tightly together from all sides. Thus the whole imaging area of the camera is fully sensitive to the radiation – there are no gaps between the tiles in the image. The camera is made robust to address industrial users.

The WidePI1×15 – MPX3 camera offers built-in Time-Delayed-Integration (TDI) for scanning in industrial applications. It is very advantageous for continuous scanning.

WidePI2(1)X15 – MPX3 is available with Si and CdTe sensors for imaging of the soft and hard X-ray spectrums, respectively.

The minimum detectable energy is typically 3 keV or 5 keV in case of Si or CdTe sensor, respectively. The intrinsic spatial resolution of the camera is defined by pixel size which is 55 µm. The pixels situated on the border of tiles are 2 times larger in one direction. The corner pixels of tiles are 2 times larger in both directions.

Ask us about - Industrial Spectral Scanner Camera - WidePIX L 2(1)X15 - MPX3